Pick-up apparatus and method for semiconductor devices

Details Pick-up apparatus and method for semiconductor devices Pick-up apparatus and method for semiconductor devices

1996-05-29

1999-08-31

Boudreau, Leo H.

Image analysis

Applications

Manufacturing or product inspection

382151, 382145, 348 87, 348126, G06K 900

Patent

active

059464097

ABSTRACT:
A pick-up operation is improved by finding a next non-faulty chip during pick-up of a non-faulty chip. Chips are disposed in alignment with X and Y directions as divided from a wafer, and the field of view of a camera which views the chips is established to provide the image data for the chips. A first non-faulty chip is selected, located at the center of the field of view of the camera, and picked up. During the pick-up of the first non-faulty chip, a chip group comprising a given number of chips is subjected to a preceding recognition which determines a next non-faulty chip to be selected on the basis of the image data. The next non-faulty chip is then positioned at the center of the field of view of the camera for a pick-up operation, thereby saving time period for pick-up operation.

REFERENCES:
patent: 5377405 (1995-01-01), Sakurai et al.
patent: 5570993 (1996-11-01), Onodera et al.
patent: 5640101 (1997-06-01), Kuji et al.

Affiliated with

Also associated with

Rating

Pick-up apparatus and method for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pick-up apparatus and method for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pick-up apparatus and method for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2428248