Pick-up apparatus and method for semiconductor chips

Details Pick-up apparatus and method for semiconductor chips Pick-up apparatus and method for semiconductor chips

1996-05-29

1999-08-31

Boudreau, Leo H.

Image analysis

Applications

Manufacturing or product inspection

382145, 382151, 348 87, 348126, G06K 900

Patent

active

059464089

ABSTRACT:
A method for sequentially picking up non-faulty chips arranged on an X-Y table. A plurality of chips disposed in an aligned arrangement is viewed by a camera in a field of view of the camera to provide an image data for enabling a preceding image recognition for a chip simultaneously with a pick-up operation for another chip. Three chip locations adjacent to each other along a moving direction of the camera are encompassed by the field of view. During the time period for a pick-up operation of a particular chip located at the center of the field of view, a preceding recognition is conducted for the succeeding chip located adjacent to and ahead of the particular chip on the basis of image data, thereby examining whether the succeeding chip is faulty or non-faulty during the pick-up operation for the particular chip. If the succeeding chip is found to be faulty, the succeeding chip is skipped for positioning a third chip for a next pick-up operation.

REFERENCES:
patent: 5377405 (1995-01-01), Sakurai et al.
patent: 5570993 (1996-11-01), Onodera et al.
patent: 5640101 (1997-06-01), Kuji et al.

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