Pick and place head construction

Handling: hand and hoist-line implements – Utilizing fluid pressure – Venturi effect

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4147521, B25J 1506, B66C 102

Patent

active

061459011

ABSTRACT:
Disclosed is an improved pick and place head construction of a type employed for transporting individual semi-conductor chips and similar articles of manufacture during manufacturing processes, and similar non-manufacturing environments. The disclosed device includes a dual head for engaging the chips as well as improved structure for varying the space between the heads by means of programmable actuators. In one embodiment, the vacuum spindles which reciprocate axially to engage the chips are also capable of axial rotation to enable the engaged chips to be rotated as they are transported to a place location. Also disclosed are improved article engaging members formed of synthetic resinous foam materials to enable effective vacuum engagement of non-planar surfaces. One form provides for simultaneous static dissipation.

REFERENCES:
patent: 4389064 (1983-06-01), Laverriere
patent: 4480780 (1984-11-01), Claeskens et al.
patent: 4624050 (1986-11-01), Hawkswell
patent: 4741567 (1988-05-01), Zimmer et al.
patent: 4784562 (1988-11-01), Kishi et al.
patent: 4860438 (1989-08-01), Chen
patent: 4910864 (1990-03-01), Elliott
patent: 5251946 (1993-10-01), Rossmeisl et al.
patent: 5575376 (1996-11-01), Colamussi
patent: 5582450 (1996-12-01), Nagai et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pick and place head construction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pick and place head construction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pick and place head construction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2057693

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.