Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-09-26
2006-09-26
Mehta, Bhavesh M. (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S144000, C382S145000, C382S148000, C382S149000
Reexamination Certificate
active
07113630
ABSTRACT:
Methods, apparatus and data structures useful in correcting PICA image data are described. An exemplary method comprises acquiring optical image data of a target having identifiable optical-image features, acquiring PICA image data of the target having identifiable PICA-image features corresponding to the optical-image features, matching PICA-image features with corresponding optical-image features, and calculating from matched PICA-image features and optical-image features a set of coefficients defining relationships between observed positions of PICA-image features and optical-image features. Corrections are applied to the observed positions of detected photons based on the coefficients. The coefficients may provide a local correction using a bilinear relationship giving the transformation of a rectangle formed by four features of the PICA-image data to fit a corresponding rectangle in the optical-image data. Alternatively, the coefficients may provide a global mapping function defining transformation of any point of the PICA-image data to fit a corresponding point in the optical-image data.
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Coupanec Patricia Le
Dajee Girish
Leibowitz Martin D.
Credence Systems Corporation
Dorsey & Whitney LLP
Mehta Bhavesh M.
Strege John B.
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