Physically separating printed circuit boards with a resilient, c

Details Physically separating printed circuit boards with a resilient, c Physically separating printed circuit boards with a resilient, c

1997-03-14

1999-12-07

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361744, 361790, 361803, 439 66, 439591, H05K 114, H05K 111, H01R 2368, H01R 2372

Patent

active

059994142

ABSTRACT:
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

REFERENCES:
patent: 3851297 (1974-11-01), Munro
patent: 3904934 (1975-09-01), Martin
patent: 5102343 (1992-04-01), Knoight et al.
patent: 5230632 (1993-07-01), Baumberger et al.
patent: 5617866 (1997-04-01), Marian, Jr.

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