Physical vapor deposition employing ion extraction from a plasma

Details Physical vapor deposition employing ion extraction from a plasma Physical vapor deposition employing ion extraction from a plasma

1993-10-08

1996-01-09

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20429805, 20429806, 20429807, 20429809, C23C 1435

Patent

active

054826110

ABSTRACT:
A sputter magnetron ion source for producing an intense plasma in a cathode container which ionizes a high and substantial percentage of the sputter cathode material and means for extracting the ions of the cathode material in a beam. The ion extraction means is implemented by a magnetic field cusp configuration with a null region adjacent to the open end of the cathode container. Ions so produced are able to be directed at right angles to a substrate being coated for efficient via filling.

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