Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate
2007-02-08
2009-11-10
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
C257S717000, C257SE27122
Reexamination Certificate
active
07615832
ABSTRACT:
A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.
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Abe Ryuichiro
Kondoh Ichiharu
Nakajima Yoshio
Yamanaka Akitoshi
DENSO CORPORATION
Mandala Victor A
Posz Law Group , PLC
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