Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element
Reexamination Certificate
2007-09-04
2007-09-04
Chapman, John E. (Department: 2856)
Measuring and testing
Speed, velocity, or acceleration
Acceleration determination utilizing inertial element
C073S493000, C361S280000
Reexamination Certificate
active
11052090
ABSTRACT:
A physical quantity sensor includes: a circuit chip; and a sensor chip disposed on the circuit chip through an adhesive layer. The sensor chip includes: a support substrate; a movable electrode; and a pair of fixed electrodes facing the movable electrode with a detection distance therebetween. The movable electrode and the fixed electrodes are disposed on the substrate. The adhesive layer includes a non-adhesive region and a conductive member. The non-adhesive region is disposed on a region obtained by projecting the sensor chip to the circuit chip. The conductive member is disposed in the non-adhesive region for electrically connecting between the circuit chip and the substrate.
REFERENCES:
patent: 5864063 (1999-01-01), Otani et al.
patent: 6151966 (2000-11-01), Sakai et al.
patent: 6644117 (2003-11-01), Kueck et al.
patent: 6763716 (2004-07-01), Nagahara et al.
patent: 6935176 (2005-08-01), Goto et al.
Examination Report from Chinese Patent Office issued on Aug. 25, 2006 for the corresponding Chinese patent application No. 200510007074.9 (a copy and English translation thereof).
Chapman John E.
DENSO CORPORATION
Posz Law Group , PLC
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