Phototreating method and apparatus therefor

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 531, 156643, B05D 306, B05D 132, B05D 100

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active

051126451

ABSTRACT:
A phototreating method comprises the steps of introducing a photoreactive gas into a chamber housing a workpiece, emitting first light substantially perpendicularly to a surface of the workpiece, and emitting second light substantially perpendicularly to the surface of the workpiece simultaneously with or after radiation of the first light. The surface of the workpiece is coated utilizing a photochemical reaction of the photoreactive gas caused by radiation of the first light and the second light.

REFERENCES:
patent: 4529475 (1985-07-01), Okano
patent: 4609566 (1986-09-01), Hongo
patent: 4615765 (1986-10-01), Levinson
patent: 4784963 (1988-11-01), Krimmel
Japanese Journal of Applied Physics, Supplements 16th Int. Conf. Solid State Devices and Mataerials, Aug. 30, 1984, Tokyo, pp. 441-446; Y. Horiike et al.: "Photo-Excited Dry Etching for VLSI's".
Japanese Journal of Applied Physics, Supplements 14th Int., vol. 22, No. 22-21, 1983, Tokyo, pp. 161-166, D. J. Ehrlich et al.: "Laser Photochemical Processing for Microelectronics".
Japanese Journal of Applied Physics, vol. 24, No. 1, Jan. 1985, Tokyo, pp. 68-74, H. Okano et al.: "Photo-Excited Etching of Poly-Crystalline and Single-Crystalline Silicon in C12 Atmosphere".
Solid State Technology 28 (1985) Apr., No. 4, Port Washington, N.Y.

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