Radiation imagery chemistry: process – composition – or product th – Radiation sensitive product – Silver compound sensitizer containing
Reexamination Certificate
2005-10-25
2005-10-25
Chea, Thorl (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Radiation sensitive product
Silver compound sensitizer containing
C430S264000, C430S531000, C430S621000, C430S622000
Reexamination Certificate
active
06958209
ABSTRACT:
A photothermographic material comprising a support and having thereon an image forming layer containing an organic silver salt, light-sensitive silver halide grains, binder and a reducing agent, wherein the reducing agent comprises: a reducing agent A containing at least a bisphenol derivative represented by following Formula (A-1); and a reducing agent B containing at least a bisphenol derivative not represented by the Formula (A-1), and the amount of reducing agent A is 5 to 45 weight % of the total weight of the reducing agent A and reducing agent B.
REFERENCES:
patent: 3100704 (1963-08-01), Coles
patent: 4102312 (1978-07-01), Sashihara et al.
patent: 6376166 (2002-04-01), Oya et al.
patent: 2001/0029000 (2001-10-01), Yoshioka et al.
patent: 0274402 (1988-07-01), None
European Search Report EP 03 25 0055.
One sheet of Patent Abstracts of Japan, Publication No. 2001209145, Publication date: Aug. 3, 2001.
English Abastract only.
One sheet of English Abstract only of XP-002266557, Fuji Photo Film Co., Ltd.
Two sheets of English Abstract only of XP-002266558, Konica Corp.
Goto Narito
Morita Kiyokazu
Nishijima Ayumu
Chea Thorl
Konica Corporation
Lucas & Mercanti LLP
LandOfFree
Photothermographic material and image forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photothermographic material and image forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photothermographic material and image forming method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3490056