Photosetting composition containing modified epoxy resins and an

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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Details

525922, 20415915, 20415919, 20415923, C08L 6300

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active

043683002

ABSTRACT:
A photosetting composition comprises an unsaturated acid-modified bisphenol type epoxy compound having an acryloyl radical; an oligoester diacrylate compound having a molecular weight of 420 or more; a photopolymerizable acrylate type monomeric compound having a molecular weight of 100 to 400; a bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C. or a saturated acid-modified bisphenol type epoxy resin having a softening point of 50.degree. C. to 150.degree. C.; and a photopolymerization initiator, said composition having a proper viscosity and an excellent photocuring reaction rate and being able to form a photocured resinous film or article having a satisfactory Dupont impact strength, impact bending strength, and bonding property to metallic materials.

REFERENCES:
patent: 3256226 (1966-06-01), Fekete
patent: 3301743 (1967-01-01), Fekete
patent: 3793398 (1974-02-01), Hokamura
patent: 3808114 (1974-04-01), Tsvchihama
patent: 3882187 (1975-05-01), Takiyama
patent: 3968016 (1976-07-01), Wismen
patent: 4014771 (1977-03-01), Rosenkranz
patent: 4100045 (1978-07-01), Bogan

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