Photosensor package with defined locations for lens supporting l

Details Photosensor package with defined locations for lens supporting l Photosensor package with defined locations for lens supporting l

1995-06-05

1997-01-07

Westin, Edward P.

Radiant energy

Photocells; circuits and apparatus

Housings

250216, 2502141, H04B 1000

Patent

active

055919669

ABSTRACT:
An optical element supported to an optical element supporting lead is sealed by a package having a lens. A height t2 from the rear surface of the optical element supporting lead at the portion projected outside from the package to the rear surface of the package is set to be substantially equal to a height t1 from the surface of the optical element to a top of a lens or the difference between the heights t1 and t2 is set small. Thus, the package can be assembled into a printed circuit board or the like by an insertion machine. Moreover, a power-saving and a mass-production become possible.

REFERENCES:
patent: 4818859 (1989-04-01), Hough
patent: 5170453 (1992-12-01), Go et al.

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