Photosensitizing chip package and manufacturing method thereof

Details Photosensitizing chip package and manufacturing method thereof Photosensitizing chip package and manufacturing method thereof

2007-01-25

2011-12-13

Wilson, Allan R (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000, C257SE31127, C438S064000, C438S065000, C438S116000

Reexamination Certificate

active

08076744

ABSTRACT:
A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.

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