Photosensitive reworkable encapsulant

Details Photosensitive reworkable encapsulant Photosensitive reworkable encapsulant

1996-08-14

1999-12-28

Nguyen, Nam

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522100, 522103, 522170, C08F 246

Patent

active

060082666

ABSTRACT:
An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: ##STR1## wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R.sub.1 and R.sub.4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R.sub.2 and R.sub.3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl; as well as a photoinitiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly.

REFERENCES:
patent: 2895962 (1959-07-01), Fischer
patent: 4216288 (1980-08-01), Crivello
patent: 4245029 (1981-01-01), Crivello
patent: 4256828 (1981-03-01), Smith
patent: 4289595 (1981-09-01), Tortorello
patent: 4442197 (1984-04-01), Crivello et al.
patent: 4987158 (1991-01-01), Eckberg
patent: 5102772 (1992-04-01), Angelo et al.
patent: 5155143 (1992-10-01), Koleske
patent: 5229251 (1993-07-01), Babich et al
patent: 5366846 (1994-11-01), Knudsen et al.
patent: 5373032 (1994-12-01), Miller et al.
patent: 5439766 (1995-08-01), Day et al.
patent: 5439779 (1995-08-01), Day et al.
patent: 5512613 (1996-04-01), Afzali-Ardakani et al.
patent: 5560934 (1996-10-01), Afzali-Ardakani et al.
patent: 5599651 (1997-02-01), Steinmann et al.
Stephen L Buchwalter and Laura L Kosbar, "Cleavable Epoxy Resins: Design for Disassembly of a Thermoset", Journal of Polymer Science Part A: Polymer Chemistry, vol. 34, pp. 249-260, Jan. 18, 1996.

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