Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Reexamination Certificate
2006-06-06
2006-06-06
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
C430S018000, C430S191000, C430S192000, C430S193000, C430S326000, C430S330000
Reexamination Certificate
active
07056641
ABSTRACT:
A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
REFERENCES:
patent: 4339521 (1982-07-01), Ahne et al.
patent: 4371685 (1983-02-01), Ahne et al.
patent: 4395482 (1983-07-01), Ahne et al.
patent: 4622285 (1986-11-01), Ahne et al.
patent: 4849051 (1989-07-01), Ahne et al.
patent: 5021320 (1991-06-01), Mueller et al.
patent: 5037720 (1991-08-01), Khanna
patent: 5077378 (1991-12-01), Mueller et al.
patent: 5081000 (1992-01-01), Kuehn et al.
patent: 5096999 (1992-03-01), Hellmut et al.
patent: 5240819 (1993-08-01), Mueller et al.
patent: 5449584 (1995-09-01), Banba et al.
patent: 5783654 (1998-07-01), Sezi et al.
patent: 5922825 (1999-07-01), Sezi et al.
patent: 5973202 (1999-10-01), Sezi et al.
patent: 6071666 (2000-06-01), Hirano et al.
patent: 6120970 (2000-09-01), Sezi et al.
patent: 6127086 (2000-10-01), Waterson et al.
patent: 6143467 (2000-11-01), Hsu et al.
patent: 6153350 (2000-11-01), Sezi et al.
patent: 6177225 (2001-01-01), Weber et al.
patent: 6207356 (2001-03-01), Banda et al.
patent: 6235436 (2001-05-01), Hirano et al.
patent: 6939659 (2005-09-01), Naiini et al.
patent: 11-109635 (1999-04-01), None
Jan Rabek, Experimental Methods in Polymer Chemistry, John Wiley & Sons, New York, 1983. (This reference is a book).
Hsu Steve Lien-Chung
Naiini Ahmad A.
Waterson Pamela D.
Weber William D.
Arch Specialty Chemicals, Inc.
Chu John S.
Ohlandt Greeley Ruggiero & Perle LLP
LandOfFree
Photosensitive resin compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin compositions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3677222