Photosensitive resin compositions

Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer

Reexamination Certificate

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C430S191000, C430S270100, C430S325000, C430S330000, C430S906000

Reexamination Certificate

active

06929891

ABSTRACT:
A heat resistant negative working photosensitive composition that comprises(a) one or more polybenzoxazole precursor polymers (I):wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar1is selected from the group consisting of a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar2is selected from the group consisting a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, a divalent aliphatic group that may contain silicon, or mixtures thereof; Ar3is selected from the group consisting a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar4is selected from the group consisting Ar1(OH)2or Ar2; G is an organic group selected from the group consisting groups having a carbonyl, carbonyloxy or sulfonyl group attached directly to the terminal NH group of the polymer;(b) one or more photo-active compounds which release acid upon irradiation (PAGs);(c) a latent crosslinker which contains at least two ˜N—(CH2OR)nunits wherein n=1 or 2 and R is a linear or branched C1-C8alkyl group, with the proviso that when a glycoluril is employed as the latent crosslinker, the G group in the polybenzoxazole precursor polymer is produced from the reaction of a cyclic anhydride; and(d) at least one solvent that is not NMP.

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