Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2006-03-22
2008-08-05
Chu, John S (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S190000, C430S191000, C430S192000, C430S193000, C430S270100, C430S280100, C430S325000, C430S326000, C430S330000
Reexamination Certificate
active
07407731
ABSTRACT:
A photosensitive resin composition comprising:(a) at least one polybenzoxazole precursor polymer;(b) at least one compound having Structure VI wherein, V is CH or N, Y is O or NR3wherein R3is H, CH3or C2H5, R1and R2each independently are H, C1-C4alkyl group, C1-C4alkoxy group, cyclopentyl or cyclohexyl, or alternatively, R1and R2can be fused to produce a substituted or unsubstituted benzene ring; and(c) at least one solvent;wherein the amount of the compound of Structure VI present in the composition is effective to inhibit residue from forming when the composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate, andwith the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety in the polymer, then(d) at least one photoactive compound is also present in the composition. The present invention also concerns a process for forming a relief pattern and electronic parts using the composition.
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Metivier N. Jon
Naiini Ahmad A.
Perry Donald F.
Powell David B.
Chu John S
Fish & Richardson P.C.
Fujifilm Electronic Materials U.S.A., Inc.
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