Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2007-05-22
2007-05-22
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S190000, C430S191000, C430S192000, C430S193000, C430S270100, C430S280100, C430S326000, C430S330000
Reexamination Certificate
active
11445764
ABSTRACT:
A photosensitive resin composition comprising:(d) at least one polybenzoxazole precursor polymer(e) at least one compound having structure VIin-line-formulae description="In-line Formulae" end="lead"?V1—Y—V2VIin-line-formulae description="In-line Formulae" end="tail"?wherein Y is selected from S, O, NR2, (HOCH)p, andeach R1is selected H, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group or a halogen, each R2is selected from H, SH, CH3, C2H5, and a linear or branched C1–C4alkyl group containing a thiol group; p is an integer of from 1 to 4, and wherein V1and V2are independently selected from the group consisting ofwherein, m is independently an integer from 0 to 4 with the proviso that m=0 only when Y=n is an integer from 1 to 5; and each R1is defined as above; and(f) at least one solvent;wherein the amount of the compound of Structure VI present is an amount effective to inhibit residue from forming when the composition is coated on a substrate and the substrate is subsequently processed to form an image, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then(d) at least one photoactive compound is also present in the composition.
REFERENCES:
patent: 3645772 (1972-02-01), Jones
patent: 3873316 (1975-03-01), Velten et al.
patent: 5434031 (1995-07-01), Nakao et al.
patent: 5496590 (1996-03-01), Maki et al.
patent: 6001517 (1999-12-01), Kawamonzen
patent: 6177225 (2001-01-01), Weber et al.
patent: 6214516 (2001-04-01), Waterson et al.
patent: 09325480 (1997-12-01), None
Studies of polyimide/copper interface and its improvement by a two-component primer, Dong, Jian, et al. Department Polymer Science and Engineering, Nanjing University, Nanjing, 210093, Peop. Rep. China, Huethig & Wepf, pp. 143-157, 1995.
The formation of an effective anti-corrosion film on copper surfaces from 2-mercaptobenzimidazole solution, Xue, Gi et al., Dep. Chem., Nanjing Univ., Nanjing, 210008, Peop. Rep. China, Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, pp. 139-148, 1991.
Hopla Richard
Metivier N. Jon
Naiini Ahmad A.
Powell David B.
Rushkin Il'ya
Chu John S.
Fujifilm Electronic Materials U.S.A., Inc.
Ohlandt Greeley Ruggiero & Perle LLP
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