Photosensitive resin compositions

Details Photosensitive resin compositions Photosensitive resin compositions

1975-05-05

1977-05-24

Brammer, Jack P.

Gas separation: apparatus

Solid sorbent apparatus

With programmed, cyclic, or time responsive control means

96115P, 20415915, 260 775CR, 260836, 260837R, G03C 168, G08F 800, G08L 6106

Patent

active

040253481

ABSTRACT:
A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.

REFERENCES:
patent: 3380831 (1968-04-01), Cohen et al.
patent: 3486903 (1969-12-01), Henkler et al.
patent: 3796578 (1974-03-01), Hosoi et al.
patent: 3859098 (1975-01-01), Iwama et al.
patent: 3861917 (1975-01-01), Magnotta et al.
patent: 3881935 (1975-05-01), Apellaniz
patent: 3895952 (1975-07-01), Schlesinger

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