Photosensitive resin composition solution

Details Photosensitive resin composition solution Photosensitive resin composition solution

1988-05-11

1990-02-20

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 79, 522 26, 522 81, 522 96, 522100, 430280, 430281, G03C 100, H05K 328, C08F 250, C08K 322

Patent

active

049027263

ABSTRACT:
There is disclosed a photosensitive resin composition solution for formation of a printed wiring board permanent mask to be coated on a substrate to be coated according to the curtain flow coating method or the roll coating method, which comprises (A) an oligomer having at least one epoxy group and at least one polymerizable vinyl group in the side chain, (B) a photopolymerization initiator, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent, characterized in that (1) the solvent (E) contains 10 to 20% by weight of at least one low boiling point solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone and ethyl acetate based on the total amount of the solvent, and (2) the composition solution has a viscosity at 25.degree. C. of 100 mPas or more and 200 mPas or less.

REFERENCES:
patent: 4005244 (1974-09-01), Wismer et al.
patent: 4544623 (1985-10-01), Audykowski et al.

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