Photosensitive resin composition, production method for...

Details Photosensitive resin composition, production method for... Photosensitive resin composition, production method for...

2008-07-30

2009-10-06

Chu, John S (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S191000, C430S192000, C430S193000, C430S270100, C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

07598009

ABSTRACT:
According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at least two sulfonate ester groups; a production method for a cured relief pattern using the photosensitive resin composition; and a semiconductor device containing the cured relief pattern formed according to the production method.

REFERENCES:
patent: 7056641 (2006-06-01), Naiini et al.
patent: 56-27140 (1981-03-01), None
patent: 2002-526793 (2002-08-01), None
patent: 2006-10781 (2006-01-01), None
patent: 2006-126809 (2006-05-01), None

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