Photosensitive resin composition, photosensitive element...

Details Photosensitive resin composition, photosensitive element... Photosensitive resin composition, photosensitive element...

2006-05-23

2006-05-23

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Nonsilver image

C430S270100, C430S280100, C430S325000

Reexamination Certificate

active

07049036

ABSTRACT:
Disclosed are a photosensitive resin composition comprising a photosensitive resin (A), a photopolymerization initiator (B), and a flame retardant (C), in which a content of halogen atoms or antimony atoms in the flame retardant is 5% or less by weight; a photosensitive element using this; a method of manufacturing a resist pattern; a resist pattern; and a resist pattern laminated substrate.

REFERENCES:
patent: 3899611 (1975-08-01), Hall
patent: 4247621 (1981-01-01), Sano et al.
patent: 4803115 (1989-02-01), Fushiki et al.
patent: 4812489 (1989-03-01), Watanabe et al.
patent: 4948700 (1990-08-01), Maeda et al.
patent: 5124234 (1992-06-01), Wakata et al.
patent: 5158999 (1992-10-01), Swales et al.
patent: 5604080 (1997-02-01), Suzuki et al.
patent: 5674947 (1997-10-01), Oishi et al.
patent: 5677450 (1997-10-01), Suzuki et al.
patent: 5858616 (1999-01-01), Tanaka et al.
patent: 6077647 (2000-06-01), Tanaka et al.
patent: 6139998 (2000-10-01), Mochizuki et al.
patent: 6248501 (2001-06-01), Tanaka et al.
patent: 6596893 (2003-07-01), Nakacho et al.
patent: 0768573 (1997-04-01), None
patent: 2-294371 (1990-12-01), None
patent: 8-292567 (1996-11-01), None
patent: 9-258446 (1997-10-01), None
patent: 11184087 (1999-07-01), None
patent: 11288090 (1999-10-01), None
patent: 20003039 (2000-01-01), None
patent: 20007974 (2000-01-01), None
www.cibasc.com Information about CIBA IRGACURE 907.
JP 09-258446 A, Machine Translation provided by http://www. ipdl.jpo.go.jp/homepg—e.ipdl.
English Language Abstract of JP 9-258446.
English Language Abstract of JP 11-184087.
English Language Abstract of JP 8-292567.
English Language Abstract of JP 11-288090.
English Language Abstract of JP 2-294371.
English Language Abstract of JP 2000-3039.
English Language Abstract of JP 2000-7974.

Affiliated with

Also associated with

Rating

Photosensitive resin composition, photosensitive element... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition, photosensitive element..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition, photosensitive element... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3585268