Photosensitive resin composition for producing a relief printing

Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4302861, 430306, 430309, 4302841, G03C 300, G03F 7035

Patent

active

055893066

ABSTRACT:
A photosensitive resin composition for producing a relief printing plate is disclosed, which comprises a polymer selected from the group consisting of a prepolymer, a binder polymer and a mixture thereof, an ethylenically unsaturated monomer, a specific hindered amine and a photopolymerization initiator. Even when the photosensitive resin composition is excessively irradiated with strong actinic rays in order to cure the resin composition to its inner portion sufficiently, the surface of the resin composition does not undergo photodeterioration by virtue of the hindered amine contained therein, thereby imparting excellent toughness to the photocured resin composition throughout the entire thickness thereof. Thus, a relief printing plate having excellent printing resistance can be produced.

REFERENCES:
patent: 3663222 (1972-05-01), Akamatsu et al.
patent: 4563438 (1986-01-01), Berner et al.
patent: 4600667 (1986-07-01), Uchida
patent: 4927723 (1990-05-01), Cusoin
patent: 5034307 (1991-07-01), Riediker et al.
patent: 5085669 (1992-02-01), Frommeld et al.
patent: 5288571 (1994-02-01), Nakamura et al.
Derwent AN88-168459 [25] WPIDS of DE 3641014 (Pub Jun. 1988).
Herbert Czichon et al, "Technology of Manufacturing Photo-Relief Forms", Polish Technology Reviews, 1982 pp. 38-40.
Stohler et al., Pertial English translation of "New Results Considering . . . ", Die Angewandte Makromolekulare Chemie, 158/159, 233-246, 1988.
"Photoinitiators for Daylight Curable Coatings", Research Disclosure, 28347, Nov. 1987.
Berner et al., J. Oil Col. Chem. Assoc., 61, 1978, 105-113.
English-Language Translation of JP 62-231245 Pub Oct. 1987.
Patent Abstracts of Japan, vol. 9, No. 41 (C-267) [1764] Feb. 21, 1985 of JP-A-59-184 227 (Mitsubishi Kasei Kogyo K.K.) Oct. 19, 1984. (Abstract).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photosensitive resin composition for producing a relief printing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition for producing a relief printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition for producing a relief printing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1141034

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.