Photosensitive resin composition for photoresist

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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C430S191000, C430S192000, C430S193000, C430S280100, C430S281100, C430S288100

Reexamination Certificate

active

07101650

ABSTRACT:
The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.

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patent: 6004720 (1999-12-01), Takechi et al.
patent: 6399267 (2002-06-01), Nishimura et al.
patent: 2003/0193624 (2003-10-01), Kobayashi et al.
patent: 2005/0042536 (2005-02-01), Cho et al.
patent: 1 085 379 (2001-03-01), None
patent: 1 122 605 (2001-08-01), None

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