Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1991-09-27
1994-09-20
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430165, 430167, 430189, 430191, 430193, 430197, 430330, 528353, 525436, G03F 7023, G03F 730
Patent
active
053488350
ABSTRACT:
Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.
REFERENCES:
patent: 3261811 (1966-07-01), Tatum
patent: 4385165 (1983-05-01), Ahne et al.
patent: 4622285 (1986-11-01), Ahne
patent: 4847359 (1989-07-01), Pfeifer et al.
patent: 4880722 (1989-11-01), Moreau et al.
patent: 4897461 (1990-01-01), Uekita et al.
patent: 4927736 (1990-05-01), Mueller et al.
patent: 4942108 (1990-07-01), Moreau et al.
patent: 5037720 (1991-08-01), Khanna
patent: 5037949 (1991-08-01), Mueller et al.
patent: 5114826 (1992-05-01), Kwong et al.
SPIE, vol. 1086, "Advances in Resist Technology and Processing VI (1989) Moss et al: Positive-working polyimide resists based on . . . ".
Hayase Rumiko
Hayase Shuzi
Kihara Naoko
Matake Shigeru
Mikogami Yukihiro
Bowers Jr. Charles L.
Chu John S.
Kabushiki Kaisha Toshiba
LandOfFree
Photosensitive resin composition for forming polyimide film patt does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition for forming polyimide film patt, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition for forming polyimide film patt will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2429765