Photosensitive resin composition comprising a polyimide precurso

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430165, 430193, 430320, 430326, G03F 7023, G03F 740

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active

055738869

ABSTRACT:
A photosensitive resin composition which comprises (A) a polyimide resin precursor of recurring units of a specific type, (B) at least one member selected from the group consisting of photosensitive diazoquinone compounds of the following formulas ##STR1## wherein R.sup.2 represents an organic group having from 1 to 50 carbon atoms, i is an integer of from 1 to 7, and i is an integer of from 1 to 7, and (C) a phenolic novolac resin. A method for forming a polyimide film pattern on various types of substrates is also described wherein a composition film is alkali-developed after imagewise exposure and cured to provide a heat-resistant polyimide film pattern suitable for protecting the substrate.

REFERENCES:
patent: 5104768 (1992-04-01), Sassmannshausen et al.
patent: 5114826 (1992-05-01), Kwong et al.
patent: 5348835 (1994-09-01), Oba et al.
patent: 5441845 (1995-08-01), Okinoshima et al.
"Preparation of Positive Photoreactive Polyimides and their Characterization" Journal of Applied Polymer Science, vol. 33, 1763-1775 (1987).

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