Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2007-05-08
2007-05-08
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S165000, C430S191000, C430S192000, C430S193000, C430S326000, C430S330000
Reexamination Certificate
active
10514812
ABSTRACT:
The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100° C. or higher and 140° C. or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing.
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Miyoshi Kazuto
Okuda Ryoji
Tomikawa Masao
Chu John S.
Morrison & Foerster / LLP
Toray Industries Inc.
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