Photosensitive resin composition and photosensitive resin lamina

Stock material or miscellaneous articles – Composite – Of polyamidoester

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4284242, 4284244, 4284248, 4284251, 4284255, 430260, 430259, 4302841, 1562755, 1562722, 522 88, 522 93, 522 95, 522 97, 451 75, B32B 2712, B32B 2716, B32B 2740, B32B 2728

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059195690

ABSTRACT:
A photosensitive resin composition comprising the following components (A), (B), (C) and (D): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, (D) a polymeric complex of an alkali thioxanate wherein the photosensitive resin composition has an electrical insulation resistance of 8.0.times.10.sup.9 to 1.0.times.10.sup.14 .OMEGA..multidot.cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.

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