Photosensitive resin composition and pattern formation using the

Details Photosensitive resin composition and pattern formation using the Photosensitive resin composition and pattern formation using the

1989-03-21

1993-06-01

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430192, 430512, G03F 7023, G03C 161

Patent

active

052158586

ABSTRACT:
A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.

REFERENCES:
patent: 4174222 (1979-11-01), Komine et al.
patent: 4297428 (1981-10-01), Yamamoto
patent: 4330608 (1982-05-01), Limburg et al.
patent: 4486518 (1984-12-01), Kesselman et al.
patent: 4847178 (1989-07-01), Komano
patent: 4871644 (1989-10-01), Bauer
Patent Abstracts of Japan, vol. 7, No. 270, Dec. 1983.

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