Photosensitive resin composition and method for forming a patter

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430165, 430190, 430193, 430326, G03F 7023

Patent

active

056353294

ABSTRACT:
A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound (A) of the following formula (A) with 2 formaldehyde (a) and at least one carbonyl compound (b) of the following formula (B), in which the mixing ratio of the formaldehyde (a) to the carbonyl compound (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b), and the alkaline soluble resin has partial structures of the following formula (C), in which the weight ratio of repeating units (.beta.) wherein m is from 1 to 5, to repeating units (.alpha.) wherein m is 0, i.e. the weight ratio of (.beta.)/(.alpha.), is at most 0.25: ##STR1## wherein R.sup.1 is a group of the formula R.sup.2, OR.sup.3, COOR.sup.4 or CH.sub.2 COOR.sup.5, wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3, R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 may be the same or different, each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.1-4 lower alkyl group, an aryl group or an aralkyl group, R.sup.8 is the same group as R.sup.1, R.sup.9 is the same group as R.sup.6, R.sup.10 is the same group as R.sup.7, p is the same integer as n, provided that R.sup.6 and R.sup.7, and R.sup.9 and R.sup.10, are not simultaneously hydrogen atoms, and m is an integer of from 0 to 5.

REFERENCES:
patent: 5188921 (1993-02-01), Jeffries, III et al.
patent: 5196289 (1993-03-01), Jeffries, III et al.
patent: 5279918 (1994-01-01), Nishi et al.
patent: 5326665 (1994-07-01), Osaki et al.
patent: 5372909 (1994-12-01), Nishi et al.
patent: 5468590 (1995-11-01), Hashimoto et al.

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