Photosensitive resin composition and flexible printed wiring...

Details Photosensitive resin composition and flexible printed wiring... Photosensitive resin composition and flexible printed wiring...

2011-03-22

2011-03-22

McClendon, Sanza L (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S100000, C522S101000, C522S102000, C522S103000, C522S113000, C522S114000, C522S120000, C522S121000, C522S122000, C522S134000, C522S150000, C522S153000, C522S162000, C522S166000, C522S168000, C522S142000, C522S143000, C522S144000, C522S170000, C522S178000, C522S181000, C522S182000, C430S280100, C252S601000, C528S044000, C528S072000, C523S300000

Reexamination Certificate

active

07910631

ABSTRACT:
A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises:(A) a cyclic phosphazene compound represented by the following general formula (1):wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5:wherein R1is a hydrogen atom or a methyl group;(B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization;(C) an epoxy resin;(D) an ethylenically unsaturated group-containing polymerizable compound; and(E) a photopolymerization initiator;wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

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