Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

1989-01-12

1991-03-12

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Post imaging processing

Physical developing

430288, 430375, 430906, 430917, 522 65, G03F 7031, G03C 1735

Patent

active

049992791

ABSTRACT:
A photosensitive resin composition suitable for a water-developing type photosensitive resin plate as a patrix of a matrix for a rubber plate which comprises a basic nitrogen containing polyamide; a monomer having polymeric unsaturated bond; a compound of the formula (I): ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and are hydrogen, alkyl, aryl or a derivative thereof; m and n are integers of 0 to 2 and the sum of m and n is 1 to 3; and M is an alkaline metal, an alkaline earth metal or a transition metal, and a N-nitrosoamine compound of the formula (II) of the formula: ##STR2## wherein R.sub.3 and R.sub.4 are the same or different and are halogen, hydroxyl, carboxyl, alkyl, cycloalkyl, optionally substituted aryl or acyl group; X and Y are carbonyl or --O--; and p and q are 1 or 0, or a salt thereof.

REFERENCES:
patent: 4050942 (1977-09-01), Nacoi
patent: 4053317 (1977-10-01), Naka
patent: 4145222 (1979-03-01), Etoh et al.
patent: 4188222 (1980-02-01), Nezu
patent: 4198241 (1980-04-01), Bronstert et al.
patent: 4421840 (1983-12-01), Lehner et al.
patent: 4544624 (1985-10-01), Nanpai et al.

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