Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

1997-04-17

1998-12-08

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528170, 528171, 528172, 528173, 528174, 528179, 528183, 528185, 528220, 528229, 528310, 528335, 528336, 528350, 525420, 525436, C08G 6926, C08G 7310

Patent

active

058470719

ABSTRACT:
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.

REFERENCES:
patent: 5668248 (1997-09-01), Hagiwara et al.

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