Photosensitive polymide materials for electronic packaging appli

Details Photosensitive polymide materials for electronic packaging appli Photosensitive polymide materials for electronic packaging appli

1995-10-25

1998-05-26

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528170, 528172, 528173, 528174, 528179, 528188, 528220, 528229, 528310, 528322, 528350, 524600, 524606, 522 65, 522 78, 522176, 430270, 430286, C08G 7310, C08L 7700

Patent

active

057566488

ABSTRACT:
Photosensitive polyimides (Ps-PIM) materials have been synthesized that belong to three families of Ps-PIM materials. Through the use of precursors, various catalytic compositions with differing photosensitivities are provided. The results are Ps-PIM materials having increased photosensitivities at wavelengths longer than approximately 330 to 350 nm and an associated catalytic system that is insensitive to oxygen. A variety of applications, including use in holographic systems, are improved by the present invention.

REFERENCES:
patent: 4996278 (1991-02-01), Lee
patent: 5053314 (1991-10-01), Yamaoka et al.
patent: 5310862 (1994-05-01), Nomura et al.

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