Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2006-12-19
2006-12-19
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S270100, C430S326000, C430S330000, C430S906000
Reexamination Certificate
active
07150947
ABSTRACT:
A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
REFERENCES:
patent: 5114826 (1992-05-01), Kwong et al.
patent: 5288588 (1994-02-01), Yukawa et al.
patent: 5442024 (1995-08-01), Kunimune et al.
patent: 5516875 (1996-05-01), Simmons, III
patent: 6177225 (2001-01-01), Weber et al.
patent: 6436593 (2002-08-01), Minegishi et al.
patent: 6600006 (2003-07-01), Jung et al.
patent: 6875554 (2005-04-01), Hatanaka et al.
patent: 2002/0048719 (2002-04-01), Jung et a.
patent: 0 997 777 (2000-05-01), None
patent: SHO 55-30207 (1980-08-01), None
patent: HEI 1-46862 (1989-10-01), None
patent: 3-36861 (1991-06-01), None
patent: 04-204945 (1992-07-01), None
patent: P3015430 (1999-12-01), None
Communication dated Nov. 11, 2003 and European Search Report completed on Nov. 4, 2003 for App. No. EP 03 01 1014.
Nakano Hajime
Nunomura Masataka
Ooe Masayuki
Tsumaru Yoshiko
Ueno Takumi
Antonelli, Terry Stout and Kraus, LLP.
Chu John S.
Hitachi Chemical Dupont Microsystems LLC.
Hitachi Chemical Dupont Microsystems Ltd.
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