Photosensitive polyimide resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

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528125, 528126, 528128, 528172, 528173, 528179, 528188, 528220, 528229, 528350, 528353, 528171, 528174, 524600, 524607, 430270, 430283, C08G 7310, C08G 6926

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active

061600814

ABSTRACT:
The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C. or lower on a substrate, and to said polyamic acid, a polyimide film having excellent film properties, and a pattern forming process using the photosensitive polyimide resin composition.

REFERENCES:
patent: Re30186 (1980-01-01), Rubner et al.
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 4040831 (1977-08-01), Rubner et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 5238784 (1993-08-01), Tokoh et al.
patent: 5777068 (1998-07-01), Tanaka et al.
Kubota et al. J. Macromol. Sci.-Chem., A24(12):1407-1422 (1987) the month in the date of publication is not available.

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