Photosensitive polyimide precursors

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522 27, 522 28, 522164, 522149, 525420, 525421, 525928, 528313, 528315, 528316, 528353, 430194, 4302871, C08G 7312, G03F 7008

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058666273

ABSTRACT:
New photosensitive polyamic acid precursors are disclosed which have the formula: ##STR1## where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photo polymerizable group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.

REFERENCES:
patent: 4481340 (1984-11-01), Minnema et al.
patent: 5238784 (1993-08-01), Tokoh et al.
Katanka, F., Shoji, F., and Kojima, M., "Photosensitive Polyimide Precursors Using Azide Photosensitizers", Poly. Mater. Sci. Eng., vol. 66, 1992,pp. 239-240.

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