Photosensitive polyimide precursor compositions and process for

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

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528125, 528126, 528128, 528172, 528173, 528179, 528188, 528192, 528220, 528229, 528350, 528351, 528392, 522 63, 522 65, 522 78, 524600, 430270, C08G 6926, C08G 7312

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active

053108620

ABSTRACT:
A photosensitive polyimide precursor composition containing as main ingredients a poly(amic acid) wherein at least one molecular end is esterified with an alcohol, a compound containing carbon-carbon unsaturation having photoreactivity, and a photopolymerization initiator.
The photosensitive polyimide precursor composition of the present invention can be prepared without the formation of any harmful by-product. When film formed from this composition is masked for patterning and then subjected to exposure and development using a developer, the amount of exposed portion dissolved in the developer until unexposed portion is dissolved off by the developer, is small and so it is possible to obtain a thick pattern. Further, by heat-treating this pattern, there can be obtained a thick polyimide pattern.

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