Photosensitive material employing encapsulated radiation sensiti

Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product

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430211, 430235, G03C 140, G03C 100

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active

045088071

ABSTRACT:
An imaging material in which images are formed by exposing a sheet having on a surface a layer of microcapsules containing a radiation sensitive internal phase, and rupturing the microcapsules; wherein images in the form of transparent windows are formed in an opaque image-receiving layer containing a light-scattering pigment by rendering the pigment transparent with the internal phase released from the ruptured microcapsules.

REFERENCES:
patent: 2953454 (1960-09-01), Berman
patent: 3001873 (1961-09-01), Foris
patent: 3072481 (1963-01-01), Berman et al.
patent: 3090687 (1963-05-01), Berman
patent: 3116148 (1963-12-01), Miller
patent: 3181965 (1965-07-01), Michelotti
patent: 3219446 (1965-11-01), Berman
patent: 3236717 (1966-02-01), Adhikary
patent: 3576660 (1971-04-01), Bayless et al.
patent: 3700439 (1972-10-01), Phillips
patent: 3736139 (1973-05-01), Yamashita et al.
patent: 3892569 (1975-07-01), Speers
patent: 4149887 (1979-04-01), Levy
patent: 4173475 (1979-11-01), Chandross et al.
patent: 4399209 (1983-08-01), Sanders
"What's Ahead", Lloyd E. Varden, Modern Photography, p. 86, 1958.

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