Photosensitive, heat-resistant resin composition and process for

Fabric (woven – knitted – or nonwoven textile or cloth – etc.) – Coated or impregnated woven – knit – or nonwoven fabric which... – Coating or impregnation formed in situ

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

442 69, 442 70, 442164, 525180, 525183, C08G 7310, C08L 7908

Patent

active

059728078

ABSTRACT:
A film forming, photosensitive, heat-resistant resin composition including a varnish of a polyimide precursor having no photosensitivity in itself, a polymeriziable monomer or oligomer compatible with the varnish and capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for the monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting, since it can effectively avoid a reduction of the layer thickness during film formation, and ensures a low cost production process. The pattern formation process using such a resin composition is also disclosed. The polymeric composite having a particles-in-matrix microstructure and the production process thereof are also disclosed.

REFERENCES:
patent: 4389504 (1983-06-01), St. Clair et al.
patent: 4395518 (1983-07-01), Giles, Jr. et al.
patent: 4416973 (1983-11-01), Goff
patent: 4987188 (1991-01-01), Furno et al.
patent: 5438105 (1995-08-01), Nagata
Mat. Res. Soc. Symp. Proc. vol. 264 pp. 37-50.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photosensitive, heat-resistant resin composition and process for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive, heat-resistant resin composition and process for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive, heat-resistant resin composition and process for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-763837

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.