Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Forming nonplanar image
Reexamination Certificate
2006-06-27
2006-06-27
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Stripping process or element
Forming nonplanar image
C430S260000, C430S262000, C430S263000, C430S281100
Reexamination Certificate
active
07067226
ABSTRACT:
The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 μm; or a photosensitive layer having a thickness of 0.1 to 14 μm and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.
REFERENCES:
patent: 3873319 (1975-03-01), Berg
patent: 4127436 (1978-11-01), Friel
patent: 4146627 (1979-03-01), Wehinger et al.
patent: 4405394 (1983-09-01), Cohen
patent: 4803145 (1989-02-01), Suzuki et al.
patent: 5609985 (1997-03-01), Taniguchi et al.
patent: 5698366 (1997-12-01), Tutt et al.
patent: 5935761 (1999-08-01), Hwang et al.
patent: 2004/0018446 (2004-01-01), Aoki et al.
patent: 2004/0038149 (2004-02-01), Murakami et al.
patent: 0 040 842 (1981-12-01), None
patent: 0 878 739 (2002-11-01), None
patent: 51-063702 (1976-06-01), None
patent: 52-154363 (1977-12-01), None
patent: 53-031670 (1978-09-01), None
patent: 57-021890 (1982-04-01), None
patent: 57-021891 (1982-04-01), None
patent: 2000-250221 (2000-09-01), None
patent: 2001-042516 (2001-02-01), None
International Search Report for PCT/JP02/03211, mailed Jun. 18, 2002, 4 pages.
Ichikawa Tatsuya
Kubota Masao
Ohashi Takeshi
Chu John S.
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
LandOfFree
Photosensitive film for circuit formation and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive film for circuit formation and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive film for circuit formation and process for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3655913