Photosensitive epoxy-acrylate resin compositions

Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy

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96 351, 96115R, 20415916, 20415923, 260831, 260836, 260837R, 427 54, C08F 800, C08L 6302, C08L 6310, G03C 170

Patent

active

039896102

ABSTRACT:
A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.

REFERENCES:
patent: 2637715 (1953-05-01), Ott
patent: 3301743 (1967-01-01), Fekete et al.
patent: 3551246 (1970-12-01), Bassemir et al.
patent: 3674545 (1972-07-01), Strolle
patent: 3707583 (1972-12-01), McKown
patent: 3793398 (1974-02-01), Hokamura
patent: 3806483 (1974-04-01), Juba et al.

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