Photosensitive dielectric paste and electronic part made...

Details Photosensitive dielectric paste and electronic part made... Photosensitive dielectric paste and electronic part made...

2011-04-12

2011-04-12

McNeil, Jennifer C (Department: 1784)

Stock material or miscellaneous articles

Composite

Of inorganic material

C428S701000, C430S002000, C430S056000

Reexamination Certificate

active

07923132

ABSTRACT:
Provided is a photosensitive dielectric paste capable of being burned at a low temperature in a short time and forming a dielectric film (insulator film) having favorable properties, such as sintering properties or temperature characteristics of dielectric constant, and an electronic part having favorable properties having a dielectric film formed using the same. The photosensitive dielectric paste of the invention contains (a) an inorganic ingredient containing 10 to 30% by volume of dielectric powder containing a Ba—Nd—Ti complex oxide powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi in a proportion of 50 to 90% by weight in terms of Bi2O3; and (b) a photosensitive organic ingredient, in which the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide. As the supporting glass powder, a glass powder containing Si in a proportion of 70 to 90% by weight in terms of SiO2is used.

REFERENCES:
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patent: 2002/0076657 (2002-06-01), Towata
patent: 2002/0106577 (2002-08-01), Kubota
patent: 2003/0143486 (2003-07-01), Kubota et al.
patent: 6-251621 (1994-09-01), None
patent: 2000-30534 (2000-01-01), None
patent: 2000-222940 (2000-08-01), None

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