Photosensitive curable resin composition

Details Photosensitive curable resin composition Photosensitive curable resin composition

1985-04-25

1987-03-17

Phynes, Lucille M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528 31, C08G 7704

Patent

active

046508490

ABSTRACT:
The organosilicon-containing polyamic acid of the invention is a reaction product of the reactants including (1) an organosilicon compound having ethylenic unsaturation and amino-substituted hydrocarbon group, (2) a tetracarboxylic acid dianhydride and (3) a polyamino compound in an organic solvent. The polyamic acid as such and a composition comprising the same in combination with a mercapto-containing compound and/or a photosensitizer are useful as a photosensitive precursor of a polyimide resin usable in photolithographic pattern reproduction.

REFERENCES:
patent: 4293397 (1981-10-01), Sato et al.
patent: 4338426 (1982-07-01), Sato et al.
patent: 4391963 (1983-07-01), Shirahata
patent: 4551522 (1985-11-01), Fryd et al.
patent: 4558117 (1985-12-01), Nakano et al.

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