Photosensitive composition, and cured relief pattern...

Details Photosensitive composition, and cured relief pattern... Photosensitive composition, and cured relief pattern...

2008-03-14

2009-11-10

Chu, John S (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S191000, C430S192000, C430S193000, C430S270100, C430S326000, C430S330000

Reexamination Certificate

active

07615324

ABSTRACT:
A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a compound having at least one of an alkoxymethyl group and an acyloxymethyl group,wherein R1represents a divalent to octavalent organic group containing 2 or more carbon atoms, R2represents a divalent to hexavalent organic group containing 2 or more carbon atoms, each of R0and R3independently represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, m represents an integer of 0 to 2, and each of p and q represents an integer of 0 to 4, provided that p+q>0.

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Extended European Search Report dated Jul. 23, 2008.

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