Photosensitive array wherein chips are not thermally matched to

Details Photosensitive array wherein chips are not thermally matched to Photosensitive array wherein chips are not thermally matched to

1994-12-19

1995-12-05

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 702

Patent

active

054735130

ABSTRACT:
Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on a substrate to maintain reasonably consistent spacing among chips regardless of temperature conditions during use. After chips are tacked onto the substrate with uncured epoxy, the assembly is brought to a low temperature prior to the heating of the curing step. The technique permits design of the assembly to compensate for differences between the thermal coefficient of expansion of the chips and that of the substrate, while also minimizing mechanical stresses on the chips caused by heating in the course of use.

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patent: 5063286 (1991-11-01), Kaneko
patent: 5166865 (1992-11-01), Morrison et al.
patent: 5192959 (1993-03-01), Drake et al.

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