Photosensitive adhesive composition

Details Photosensitive adhesive composition Photosensitive adhesive composition

2003-04-02

2009-06-09

McClendon, Sanza L (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S150000, C522S153000, C522S154000, C522S152000, C522S035000, C522S162000, C522S167000, C522S168000, C522S169000, C522S170000, C522S173000, C522S178000, C522S181000, C522S182000, C522S031000, C522S038000, C522S032000

Reexamination Certificate

active

07544721

ABSTRACT:
A photosensitive adhesive composition of the polymerizable resin type, the hardening of which occurs by polymerization and/or reticulation, includes:—initiators for at least one chain polymerization reaction to guarantee the hardening of the composition and a sufficient quantity of at least one bifunctional monomer, including a photolabile center with at least one photolabile entity and at least two polymerizable units, connected by covalent skeletons to the photolabile center and located away from the cleavage sites of the photolabile center, such that the composition loses the integrity and adhesivity thereof under the influence of a reticulating radiation causing the cleavage of the photolabile sites. The composition is particularly of application in dentistry.

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