Photosemiconductor encapsulant of epoxy group-containing...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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Details

C524S303000, C524S548000, C525S327300

Reexamination Certificate

active

07423083

ABSTRACT:
A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):(A): a (meth)acrylic polymer containing an epoxy group, and(B): at least one hardener selected from the group consisting of the following components (b1) to (b4):(b1) a polyvalent carboxylic acid,(b2) a polyvalent carboxylic anhydride,(b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and(b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2)wherein R1to R6represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3and R4may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1to R7may be substituted by an ether group and/or carbonyl group; Y1and Y2represent each independently an oxygen atom, or sulfur atom, is provided.

REFERENCES:
patent: 2768153 (1956-10-01), Shokal
patent: 4091048 (1978-05-01), Labana et al.
patent: 4931509 (1990-06-01), Yagishita et al.
patent: 5214104 (1993-05-01), Wamprecht et al.
patent: 5719212 (1998-02-01), Nakae et al.
patent: 0789064 (1997-08-01), None
patent: 60217230 (1985-10-01), None
patent: 61-235424 (1986-10-01), None
patent: 05297590 (1993-11-01), None
patent: 06-281801 (1994-10-01), None
patent: 06-316626 (1994-11-01), None
patent: 09003405 (1997-01-01), None
patent: 10219123 (1998-08-01), None
patent: 2000-159860 (2000-06-01), None
patent: 2000-159860 (2000-06-01), None
patent: 2000-196151 (2000-07-01), None
patent: 2001019721 (2001-01-01), None
patent: WO 9324569 (1993-12-01), None
Chemical abstracts registry No. 123-28-4 for dilauryl 3,3′-thiodipropionate, 1997, 2 pages.
Chemical abstracts registry No. 2082-79-3 for ADK Stab AO 50, 1997, 2 pages.
CAPLUS accession Nos. 1960:59714 for Netherlands Patent No. 90245, 2-1959 and 1957:95365 for equivalent Great Britain Patent No. 781,416, 8-1957.

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