Photoselective electroless plating method employing UV-absorbing

Details Photoselective electroless plating method employing UV-absorbing Photoselective electroless plating method employing UV-absorbing

1986-11-24

1988-04-19

Morgenstern, Norman

Coating processes

Electrical product produced

Welding electrode

4271262, 427304, 427305, 437173, 437230, B05D 306, B05D 304, B05D 310, B05D 512

Patent

active

047388692

ABSTRACT:
A process for photoselective electroless plating is disclosed in which a semiconductor substrate (e.g. barium titanate) capable of absorbing light having a wavelength greater than 300 nm is coated with a solution containing the salt of tin, titanium, or lead (e.g. SnCl.sub.2). The coated substrate is then selectively exposed to light having a wavelength of 300-390 nm in a negative pattern; the light energy absorbed by the substrate is transferred to the coating, changing the oxidation state of the metal ion of the metal salt rendering it incapable of reducing palladium ions in a palladium chloride solution. Coating with a precious metal salt (e.g., PdCl.sub.2) and nickel disposition follow the light exposure step.

REFERENCES:
patent: Re29015 (1976-10-01), De Angelo et al.
patent: 3035944 (1962-05-01), Sher et al.
patent: 3928670 (1975-12-01), Brummett et al.
patent: 4084968 (1978-04-01), Janssen et al.

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