Photoresist stripper

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

Reexamination Certificate

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Details

C510S245000, C510S257000, C510S259000, C510S499000, C510S504000, C134S001200, C134S001300

Reexamination Certificate

active

11110533

ABSTRACT:
Recently, use is made of copper wiring as the wiring material for semiconductor devices, and of low dielectric constant films as the insulating film between the lines of wiring. In this connection, a photoresist stripper is in need which can inhibit corrosion or damage on the copper wiring or the Low-k film, and which has excellent property of removing ashed photoresist residues. The invention provides a photoresist stripper (hereinafter, referred to as the stripper of the invention) characterized in containing a tertiary amine compound, an alkaline compound, a fluoro compound, and an anionic surfactant; and a process for preparation of semiconductor devices using the stripper of the invention.

REFERENCES:
patent: 6265309 (2001-07-01), Gotoh et al.
patent: 6514352 (2003-02-01), Gotoh et al.
patent: 6599370 (2003-07-01), Skee
patent: 6777380 (2004-08-01), Small et al.
patent: 6916772 (2005-07-01), Zhou et al.
patent: 2002/0128164 (2002-09-01), Hara et al.
patent: 2003/0113673 (2003-06-01), Ahn et al.
patent: 2003/0130149 (2003-07-01), Zhou et al.
patent: 2004/0224866 (2004-11-01), Matsunaga et al.

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